Industry News

DATELINE HOLLISTER --- SEMIFAB DEVELOPS NEW SOLUTION SET FOR ACCELERATED THERMAL TESTING AND CONDITIOINING OF MICROPROCESSORS

Semifab's focus on engineering results in not only continual improvement to existing products but also in solutions to previously unanswered questions. With our proprietary engineering solutions we have been instrumental in addressing challenges for a number of high tech industries/manufacturers. A current example of this is Semifab's Microprocessor Conditioning Unit (patent pending).

As microprocessor clock speeds continue to increase the production and test burden has shifted to the thermal conditioning, test, and burn-in of these devices. Working with a number of leading semiconductor IC manufacturers, and utilizing our expertise in precise environmental control electronics and subsystems, Semifab has developed a Thermal Conditioning Unit for High Power Microprocessors that will speed integrated circuit test procedures from burn-in to system test. While the basic success criteria for the task at hand have been known for a while, the solutions to them have proven elusive. Semifab has developed solutions to a number of these questions; specifically:

• We are able to run at an industry leading 250W per device under test.
• We have solved condensation concerns in humid ambient environments.
• We have incorporated junction temperature sensing and control.
• Our system is suitable from R and D through production, and is automation compatible.

In addition to those basic features and benefits, here are some of our operating parameters:

• Operating temperature: -80 degrees C to +125 degrees C
• Temperature control: +/- 1 degree C
• Devices per system: Up to 100

We are extremely excited about this solution set, and welcome discussing how this unit may assist you in your semiconductor integrated circuit manufacturing needs.